P3063 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 7 Plus
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P3063 IC Chip BGA Reballing Stencil Kits Set Solder Template MultiFunction CPU Tin Steel Net For I Phone 7 Plus

Rs: 875 /- PKR
Availability: 1
Brand: Circuit PK
Product SKU: CKT-1865
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P3063 IC Chip BGA Reballing Stencil Kits Set

Solder Template

Multi-Function CPU Tin Steel Net

For I Phone 7 

P3063 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 7 Plus in Pakistan.

Super Administrator 29/07/2015

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